覆铜板(Copper Clad Laminate)
- 覆铜板(copper clad laminates)
- 布、席组合覆铜板(COPPER CLAD LAMINATE)
- 无铅Tg 175℃低膨胀硬质基板(质量提升)(NP-175FM)(Lead-free Tg 175℃Low CTE Rigid CCL(Quality Improvement))
- Tg 150℃多功能覆铜板(NP-150)(Tg 150℃ multifuntional Rigid CCL)
- 耐燃硬质覆铜板(FR-4-86 UV Block)(Firing Resistance Rigid CCL)
- 散热布、席组合覆铜板(CEM-3-09HT)(Thermal Conductivity CEM-3)
(台塑企业 南亚公司提供,2017/04/26)